행사가 개최되었습니다.
- IMPORTANT DATES
- 사전등록마감
2019년 10월 15일(화) 오후 1시까지
PROGRAM
프로그램
| TIME | TOPIC CHAIR/SPEAKER |
| 08:30~08:55 | REGISTERATION |
| 08:55~09:00 |
OPENING
Young-Hyun Jun, President (The Semiconductor Society, IEIE)
|
| SESSION-1 : Trends and Market | |
| 09:00~09:40 | Latest developments and trends of the fan-out and 3D-IC packaging Santosh Kumar (Yole) |
| 09:40~10:20 | 2.5D Challenges and Opportunities for heterogeneous Integration Jaesik Lee (NVIDIA) |
| 10:20~10:40 | COFFEE BREAK |
| 10:40~11:20 | Process Technology Challenges for High-Performance 3D SiP Arvind Sundarrajan (AMAT) |
| 11:20~12:00 | Advanced Package Trends Taejoo Hwang (Samsung) |
| 12:00~13:30 | LUNCH & SOCIAL |
| SESSION-2 : Technology Development | |
13:30~14:10 |
More than Moore with 3D integration technology(D2W & W2W Hybrid bonding) Wernicke Tobias (EVG) |
14:10~14:50 |
Various Interconnection Solution - FO, 3D Integration Nelson Fan (ASMPT) |
14:50~15:30 |
Ultra-thinning of device wafer and evaluation of electrical characteristics for 3D integration Youngsuk Kim (DISCO) |
15:30~15:50 |
COFFEE BREAK |
15:50~16:30 |
Optimizing CD control on high-topography reconstituted wafers Warren Flack (VEECO) |
16:30~17:10 |
Photoresist of Wafer Level Package Bong Hee Kim (Dongjin Semichem) |
17:10~17:20 |
Ki-Hyeok Kwon (Samsung SDI) CLOSING
|